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Silicon Wafer Dicing - BlackStar SW300

silicon wafer dicing laser

BLACKSTAR™ is a Wafer Dicing System utilizing Fantom Width Laser Dicing Technology® (FWLDT®) invented and patented by Fonon Technology and modified to accommodate the requirements of a silicon wafer singulation process without affecting the existent dicing method, processes or procedures.

Wafers have the highest value at the dicing stage and the primary focus of a BlackStar™ is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the HAZ specifically for “power hungry” RF micro devices and low-K wafer substrates.
System is applicable for dicing of assorted semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-k and multi-layer composite materials.

BlackStar™ is an alternative to mechanical saws too damaging and costly for cutting of thin delicate silicon, low-K and complex material wafers.

Parameter	Value
Material	Low-K
Street width	Thickness dependent
HAZ	0
# of passes required	1
Micro Cracks	None
Chipping	None
Edge strength	Excellent
Clean Room Compatibility	Class 1000 or 10000
Water Cooling	None

LASER

Proprietary Type

WAFER

Wafer thickness - 50µ to 700µ.
Wafer size - 12" max.
Frame: Standard types (8” or 12")
Holding tape: standard low tack

VISION SYSTEM

Two-level Magnification
Optical zoom
Type: Pattern Recognition with
Automatic alignment

MOTION SYSTEM

4 axis direct drive servo platform.
Working area 500 x 500 mm
Maximum axis speed 500 mm/s

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