Glass Panel Dicing Glass Panels

Glass Panel Dicing Glass Panels Application #131

Process: Glass Panel Dicing
Material: Glass Panels
Industry: FPD

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Application Details:

300 mm glass wafer dicing application.
Equipment: GWD500
Dicing speed: 600mm/sec
Dicing pitch: 5mm.
Scribe and break: Simultaneous



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Highlighted Application:


Application #165
Process: Silicon Wafer Dicing
Material: Semiconductor Wafers

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