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F300 Glass Wafer Cutting System

The F300 Glass Disk Cutting Machine combines stationary laser and dual optical systems with a single rotation and glass holding system. This allows for highly accurate cutting with nearly perfect concentricity.

This machine can be configured to cut many different materials: glass, Crystalline Quartz, Sapphire, Silicon, Silicon on glass, Lithium Niobate, Lithium Tantilate, or many others.

Pricing has been broken down into components to allow users to customize machine capabilities for their specific needs without incurring unnecessary costs.

Requirements beyond those listed below can be quoted on an as needed basis.

Call our office if you need any assistance determining which capabilities best suit you needs.

^{F300 Product Capabilities}

F300
Maximum Substrate Size	320x320 mm
Glass Thickness (Standard)	0.5 – 1.5 mm
Glass Thickness (Optional Max)	6 mm
Cutting Speed	30 - 150 mm/s
Processing Accuracy	+/- 0.06 mm
Average Edge Roughness (Ra)	< 0.032 um
Scribe Chips	None

F300 Machine and Facility Specifications.

F300
Laser Equipment (standard)	Sealed CO₂ Laser @ 90 W
Machine Length	838 mm
Machine Width	1239 mm
Machine Height	1718 mm (plus 362 mm safety light)
Weight	350 kg
Operating Temperature	+18 to +25^o C
Relative Humidity	40 - 80% noncondensing
Electrical Requirements	3 x 110/380 V. 50 -60 Hz, 8 kVA.
Clean Dry Air	<20% humidity at 18^o +/- 1^o C, 8 ATM
Chilled Clean Dry Air	<20% humidity at 4^o +/- 1^o C, 4 ATM
Chilled Water	18^o +/- 1^o C

Specifications subject to change without notice.

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