» Flat Panel Display Systems > FPD Laser Glass Scribing Systems > Fantom G8 Large Format Laser Scriber

Fantom G8: Large Format Laser Glass Scribing System

laser scribing dicing FPD glass

System Highlights

The Fantom G8 Glass Panel Scribing Machine utilizes the latest laser technology for glass scribing and is equipped with two integrated Laser Photonics laser sources specifically geared for processing larger format glass panels for the Flat Panel Display Industry.

The Fantom G8 Laser Scribing tool is a part of a new line of industrial laser cutting systems from Fonon DSS. It incorporates a new generation modular design laser and precision direct drive high resolution linear motion system forming a precision, stand-alone, small foot print, automatic tool which can be easily integrated into an inline system.

The system is based on Zero Width Laser Cutting Technology® (ZWLCT®).  This method splits materials at the molecular level with tremendous speed, no material loss, and no chips or other debris associated with conventional scribe and break techniques.

Applications:

  • Large Panel Glass Scribing
  • High Throughput Flat Panel Display Manufacturing
  • Touch Screens
  • Latest Generation Precision Glass Fabrication
  • Large Format Thin Film Glass Panels

Capabilities:

  • Capable of scribing glass panels up to Generation 8 sizes (2200mm x 2500mm)
  • Capable of scribing on any type of display glass (except quartz) without realignments
  • Extremely stable singulation line, ensures highest possible edge quality
  • No chipping and no glass particles generated
  • Cross Cuts - no cut initiations on the crossing, no chipping

General Advantages:

  • High scribing speed - up to 1000mm/s
  • Extremely high accuracy - up to 10 microns achievable
  • Excellent integrity of cut surfaces
  • Cut edge is free of stress, no micro-fracturing present
  • Edges have an optical quality
  • Non-dimensional cut lines are produced with no residue
  • Built-in modular (easy to replace) power supply, amplifiers, PC control, and high-voltage electronics
  • ZWLCT®- Zero Width Laser Cutting Technology® produces no particulates or material loss
  • Open configuration for the Fantom G8 has loading and unloading/breaking air/vacuum tables
  • Easy installation and modular design allows for quick start-up times
  • Modern components virtually eliminate field alignments and increase reliability for 24/7 operation



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Highlighted Application:


Application #166
Process: Silicon Wafer Dicing
Material: Semiconductor Wafers

 

 

 

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