» Technology > Glass Wafer Dicing Technology

Glass Wafer Dicing Technology: 

• As a result of exposure in camera windows and IR filter devices Fonon developed a precision separation of glass panels into individual components with the Fantom Width Laser Dicing Technology®.
• The FWLDT® splits materials at the molecular level at tremendous speed with no material loss. This results in the highest edge quality and the fastest dicing speed.
• Integrated scribe and break equipment is available for 100 x 100 mm, 200 x 200 and 300 mm in diameter glass substrates mounted on a standard 300 mm wafer hoops.
• Quick Release tape made it possible to remove individual substrates from the dicing tape without the edge damage with Pick and Place equipment.
• Laser dicing system showing below is a special machine designed for precise dicing of glass wafers.

The Glass Wafer Dicing Process:

• Mount low-tack and quick-release tape on the metal tape frame
• Laminate the substrate on the tape
• Dice the substrate into specified-dimension dies with advanced Fantom Width Laser Dicing Technology®
• Apply a cover film
• Flip upside down
• Break with a metal bar
• Expand on stretcher
• Remove individual substrates from dicing tape without edge damage with Pick Place equipment

Applications:

Advantages:

• Higher speeds
• Higher throughput
• High precision and accuracy
• No material loss
• Shortens process and can be brought into clean room
• Edges have a high resistance to breakage