» Tech Expo-Fonon Display and Semiconductor Systems Invents Laser Direct Writing

Fonon Display and Semiconductor Systems Invents Laser Direct Writing


March 10, 2009

Lake Mary, Fl., March 10, 2009 - Fonon DSS (Display & Semiconductor Systems), the innovative developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world announced the invention of Laser Direct Writing for tracking glass panels.

Traditional methods to mark panels with tracking codes such as mechanical etching or engraving using a Co2 Laser can crack the surface of the glass thereby compromising the overall strength and quality of the glass. These cracks can potentially lead to panel failure issues in the future. Additionally, the marks were not always clear enough to be scanned or read.

Laser Direct Writing is a non-destructive, patent pending laser marking technology which marks glass without damaging the surface while producing a readable image. This process does not require tapes or sprays to make the mark thereby eliminating any cleaning and post processing required with other methods.

"Panel manufacturers have been looking for a better way to mark panels with bar codes and UID marks," said Maureen McHale, the Corporate Marketing and Public Relations Manager for FononDSS. "Laser Direct Writing creates a black, semi-transparent or gold marking on glass and is ideal for tracking the life of the panel. This process does not damage the glass and ensures readability of the mark."

Fonon DSS, the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world.

Fonon DSS products and product names are either trademarks or registered trademarks of Fonon DSS. All other trademarks or registered trademarks are the property of their respective intellectual property owners.

Source: http://www.techexpo.com/news/29031303.html



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Application #162
Process: Silicon Wafer Dicing
Material: Semiconductor Wafers

 

 

 

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