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Chip Marking



Wafer marking is a requirement within the semiconductor and solar panel industries. Portable digital components, cell phones, PDAs, digital cameras, etc., become smaller and more lightweight but continue to increase in functionality. The Direct Chip Attach (DCA) or flip chip produces a need for wafer identification and tracking. Laser wafer marking has proven to be the best solution, as opposed to ink marking, because it is permanent, readable, and produces a high quality mark fulfilling wafer marking's most stringent requirements.

Applications Search:

Total Matching Applications: 138,  Displaying 1 - 3.  
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Application #105
Process: Ceramic Marking
Material: Ceramics

Application #109
Process: Ceramic Marking
Material: Ceramics

Application #131
Process: Glass Panel Dicing
Material: Glass Panels
Total Matching Applications: 138,  Displaying 1 - 3.  
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Highlighted Application:


Application #196
Process: Glass Wafer Dicing
Material: Glass

 

 

 

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