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GW500AB: Glass Wafer Dicer

glass wafer dicing system

Zero Width Laser Cutting TechnologyTM

The GW500AB is the latest generation of precision ZWLCTTM Laser Glass Wafer Dicing system for IR and CF camera windows, micro displays and other demanding applications.

LASER

  • Type Fantom™ sealed CO2 Laser
  • Sealed system allows modular replacement

WAFER

  • Material: Glass 0.3 -0.5 mm thick.
  • Wafer size - 12" max.
  • Frame: Standard types (5”, 6”, 8” or 12")
  • Holding tape: standard low tack

VISION SYSTEM

  • Two-level Magnification 
  • Optical zoom
  • Type: Pattern Recognition with Automatic Alignment

MOTION SYSTEM

  • 4 axis direct drive servo platform.
  • Working area 800 x 800 mm
  • Maximum axis speed 2000 mm/s

Applications Search:

Total Matching Applications: 138,  Displaying 1 - 3.  
Next 3 Applications >>


Application #105
Process: Ceramic Marking
Material: Ceramics

Application #109
Process: Ceramic Marking
Material: Ceramics

Application #131
Process: Glass Panel Dicing
Material: Glass Panels
Total Matching Applications: 138,  Displaying 1 - 3.  
Next 3 Applications >>






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Highlighted Application:


Application #132
Process: TFT LCD Scribing
Material: TFT LCD

 

 

 

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