Glass Cutting Dramatically Improved With Laser Glass Dicing Systems

Lake Mary, Florida--Fonon Technology International announces an increase in orders for its new generation of laser glass cutting systems. These systems are exceptionally useful and innovative for precision glass wafer dicing. Top manufacturers are effectively streamlining applications by implementing Fonon’s laser glass cutting and dicing systems. These applications range from developing cutoff filters to processing biometric ID devices and camera windows.

Fonon’s system, the WD500AB, uses image-recognition software and CCD imagers to automatically align the Zero Width laser scribing process and the subsequent part break-out. This impressive machine does this with no material loss. Furthermore, because the laser is a non-contact method there are no saw kerfs or particulate contamination to cause concern.

This is the first time in the laser industry that laser scribing and breaking has been accomplished using the same system. With the glass mounted on expandable film, the laser produces a seamless scribe line, or MicroCrack which is propagated through the wafer.

After this, the product is expanded on the expansion ring and positioned on the pick-and-place equipment for further processing. The finished product is particle-free and is ready for immediate delivery. This can usually be done using the same carriers in which the parts were cut. This drastically aids the production process because no further part handling or finishing is required.

More information can be obtained by contacting Fonon below:

Contact Us:

Fonon Technology International, LLC
250 Technology Park
Lake Mary, FL 32746
Tel: 1-407-804-1000