Laser Cutting Silicon Solar Cells

The

Blackstar™ is a Wafer Dicing System utilizing Fantom Width Laser Dicing Technology® (FWLDT®) invented and patented by Fonon Technology and modified to accommodate the requirements of a silicon wafer singulation process without affecting the existent dicing method, processes or procedures.

Wafers have the highest value at the dicing stage and the primary focus of a BlackStar™ is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the HAZ specifically for “power hungry” RF micro devices and low-K wafer substrates.

"The system is applicable for dicing of assorted semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-k and multi-layer composite materials," said Maureen McHale, Fonon DSS' Corporate Marketing and Public Relations Manager.

BlackStar™ is an alternative to mechanical saws too damaging and costly for cutting of thin delicate silicon, low-K and complex material wafers.

Fonon DSS, the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world. For more information, visit http://www.fonondss.com or call 407-829-2613.

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	Laser Cutting Silicon Solar Cells The ideal tool for laser dicing, the Blackstar™ SW300. Lake Mary, Fl., May 11, 2009 - Fonon DSS (Display & Semiconductor Systems), the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions to the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world reveals the Blackstar™ SW300 for dicing of assorted semiconductor materials such as solar cells. The Blackstar™ is a Wafer Dicing System utilizing Fantom Width Laser Dicing Technology® (FWLDT®) invented and patented by Fonon Technology and modified to accommodate the requirements of a silicon wafer singulation process without affecting the existent dicing method, processes or procedures. Wafers have the highest value at the dicing stage and the primary focus of a BlackStar™ is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the HAZ specifically for “power hungry” RF micro devices and low-K wafer substrates. "The system is applicable for dicing of assorted semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-k and multi-layer composite materials," said Maureen McHale, Fonon DSS' Corporate Marketing and Public Relations Manager. BlackStar™ is an alternative to mechanical saws too damaging and costly for cutting of thin delicate silicon, low-K and complex material wafers. Click here to watch the laser dicing BlackStar™ in action NOW! Fonon DSS, the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world. For more information, visit http://www.fonondss.com or call 407-829-2613.
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Laser Cutting Silicon Solar Cells

The ideal tool for laser dicing, the Blackstar™ SW300.