Biometrical Cutting Biometrical ID Devices

Biometrical Cutting Biometrical ID Devices Application #134

Process: Biometrical Cutting
Material: Biometrical ID Devices
Industry: Biometrical

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Application Details:

Biometric ID Devices Separating Method:

With exposure in Biometric ID devices it became necessary to find a method of PRECISION separating of glass panels into individual components without generating any debris on the glass surface. Bearing in mind that individual devices is relatively small (in average 25 x 25 mm) the handling is becoming an issue.



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Application #164
Process: Silicon Wafer Dicing
Material: Semiconductor Wafers

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