Biometrical Cutting Biometrical ID Devices

Biometrical Cutting Biometrical ID Devices Application #133

Process: Biometrical Cutting
Material: Biometrical ID Devices
Industry: Biometrical

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Application Details:

New generation of Micro Displays require the new method of PRECISION separating of glass substrates into individual displays without generating any debris on the glass surface. Because individual devices are very small (in average 15 x 15 mm) they were fixed on a special type of Quick Release film.



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Highlighted Application:


Application #165
Process: Silicon Wafer Dicing
Material: Semiconductor Wafers

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